Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

ABSTRACT

A method is proposed for fabricating a TFBGA (Thin &amp; Fine Ball-Grid Array) package with embedded heat spreader. Conventionally, since an individual TFBGA package is quite small in size, it would be highly difficult to incorporate an embedded heat spreader therein. As a solution to this problem, the proposed method utilizes a single substrate predefined with a plurality of package sites, and further utilizes a heat-spreader frame including an integrally-formed matrix of heat spreaders each corresponding to one of the package sites on the substrate. A batch of semiconductor chips are then mounted on the respective package sites on the substrate. During the encapsulation process, a single continuous encapsulation body is formed to encapsulate the entire heat-spreader frame and all the semiconductor chips. After ball implantation, a singulation process is performed to cut apart the encapsulation body into individual package units, each serving as the intended TFBGA package. In the foregoing process, since the entirety of the heat-spreader frame is relatively large in size as compared to the size of an individual TFBGA package, it can be easily handled, so that the embedding of a heat spreader in each package unit can be easily carried out.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] This invention relates to integrated circuit packagingtechnology, and more particularly, to a method of fabricating a TFBGA(Thin & Fine Ball-Grid Array) package with embedded heat spreader.

[0003] 2. Description of Related Art

[0004] BGA (Ball-Grid Array) is an advanced type of integrated circuitpackaging technology which is characterized in the package configurationof a two-dimensional array of solder balls on the bottom surface of thesubstrate where the semiconductor chip is mounted. These solder ballsallow the entire package body to be mechanically bonded and electricallycoupled to a printed circuit board (PCB).

[0005] TFBGA (Thin & Fine Ball-Grid Array) is a downsized type of BGAtechnology that provides integrated circuit packages in very smallsizes, which are customarily fabricated in batch from a single chipcarrier, such as a substrate, predefined with a matrix of package sites,from each of which a single TFBGA package unit is fabricated.Conventionally, however, it would be highly difficult to incorporate anembedded heat spreader in each individual TFBGA package since eachindividual TFBGA package is quite small in size, typically from 5 mm×5mm to 15 mm×15 mm (millimeter), and the separation between neighboringpackage sites on the substrate is only from 0.2 mm to 0.3 mm.

[0006] Related patents include, for example, the U.S. Pat. No. 5,977,626entitled “THERMALLY AND ELECTRICALLY ENHANCED PBGA PACKAGE”; the U.S.Pat. No. 5,216,278 entitled “SEMICONDUCTOR DEVICE HAVING A PAD ARRAYCARRIER PACKAGE”; and the U.S. Pat. No. 5,776,798 entitled“SEMICONDUCTOR PACKAGE AND METHOD THEREOF”; to name just a few.

[0007] The U.S. Pat. No. 5,977,626 teaches the embedding of a heatspreader in a BGA package, while the U.S. Pat. No. 5,216,278 teaches themounting of a heat spreader over the semiconductor chip to facilitateheat dissipation from the encapsulated chip. The U.S. Pat. No. 5,776,798teaches a novel TFBGA package structure and fabrication thereof However,none of these patented technologies teach the embedding of a heatspreader in each TFBGA package. Therefore, there still exists a need inthe semiconductor industry for a new integrated circuit packagingtechnology that can incorporate a heat spreader in a TFBGA package.

SUMMARY OF THE INVENTION

[0008] It is therefore an objective of this invention to provide a newintegrated circuit packaging technology that can provide each TFBGApackage with an embedded heat spreader to facilitate heat dissipationfrom the encapsulated chip.

[0009] In accordance with the foregoing and other objectives, theinvention proposes a new method for fabricating a TFBGA package withembedded heat spreader. Broadly defined, the method of the inventioncomprises the following procedural steps: (1) preparing a substratehaving a front surface and a back surface, and which is predefined witha plurality of package sites; (2) preparing a heat-spreader frameincluding an integrally-formed matrix of heat spreaders having a frontsurface and a back surface, each heat spreader corresponding to one ofthe predefined package sites on the substrate; (3) bonding andelectrically-coupling a plurality of semiconductor chips to respectivepackage sites on the front surface of the substrate; (4) assembling theheat-spreader frame to the substrate in such a manner that each heatspreader is positioned proximate to one of the semiconductor chips onthe substrate; (5) performing an encapsulation process to form anencapsulation body which encapsulates the semiconductor chips and theheat-spreader frame; (6) performing a ball-implantation process toimplant a plurality of solder balls on the back surface of thesubstrate; and (7) singulating through the encapsulation body to cutapart the plurality of package sites on the substrate into individualpackage units, each serving as the intended integrated circuit package.

[0010] The foregoing method of the invention is characterized in the useof the heat-spreader frame including an integrally-formed matrix of heatspreaders. Since the entire heat-spreader frame is relatively large insize as compared to the size of an individual TFBGA package, it would beas a whole significantly easier to handle during the fabrication processthan a single piece of heat spreader, making embedding of a single pieceof heat spreader in each TFBGA package easy to implement.

BRIEF DESCRIPTION OF DRAWINGS

[0011] The invention can be more fully understood by reading thefollowing detailed description of the preferred embodiments, withreference made to the accompanying drawings, wherein:

[0012] FIGS. 1A-1F are schematic diagrams used to depict a firstpreferred embodiment of the method of the invention for TFBGAfabrication;

[0013] FIGS. 2A-2E are schematic diagrams used to depict a secondpreferred embodiment of the method of the invention for TFBGAfabrication;

[0014] FIGS. 3A-3C are schematic diagrams used to depict a thirdpreferred embodiment of the method of the invention for TFBGAfabrication;

[0015] FIGS. 4A-4B are schematic diagrams used to depict a fourthpreferred embodiment of the method of the invention for TFBGAfabrication;

[0016]FIG. 5 is a schematic perspective view of a variety to the leggedtype of heat-spreader frame utilized by the invention;

[0017] FIGS. 6A-6C are schematic diagrams of another variety to thelegged type of heat-spreader frame utilized by the invention;

[0018] FIGS. 7A-7C are schematic diagrams of still another variety tothe legged type of heat-spreader frame utilized by the invention;

[0019] FIGS. 8A-8C are schematic diagrams of yet another variety to thelegged type of heat-spreader frame utilized by the invention;

[0020] FIGS. 9A-9C are schematic diagrams of still yet another varietyto the legged type of heat-spreader frame utilized by the invention; and

[0021] FIGS. 10A-10C are schematic diagrams of another additionalvariety to the legged type of heat-spreader frame utilized by theinvention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0022] In accordance with the invention, various preferred embodimentsare disclosed in full details in the following with reference to theaccompanying drawings.

[0023] First Preferred Embodiment (FIGS. 1A-1F)

[0024] FIGS. 1A-1F are schematic sectional diagrams used to depict theprocedural steps involved in the first preferred embodiment of themethod of the invention for fabricating a TFBGA package with embeddedheat spreader. It is to be noted that, by the invention, each TFBGApackage is fabricated in batch, and not individually, from a single chipcarrier.

[0025] Referring to FIG. 1A, by the method of the invention, the firststep is to prepare a substrate 10 (or chip carrier), which can be a BTsubstrate, or an FR4 substrate, or a polyimide tape, and which ispredefined with an array of package sites (in the example of FIG. 1A, atotal of six (6) package sites, respectively designated by the referencenumerals “11”, “12”, “13”, “14”, “15”, and “16”, are predefined; but itis to be noted that the number of package sites is an arbitrary designchoice depending on the size of the substrate 10). Each of the packagesites 11, 12, 13, 14, 15, 16 on the substrate 10 will be used as a basefor the fabrication of a single unit of TFBGA package.

[0026] Referring further to FIG. 1B, the next step is to prepare aheat-spreader frame 20 including an integrally-formed matrix of heatspreaders (in the example of FIG. 1B, the beat-spreader frame 20includes a total of six (6) heat spreaders, respectively designated bythe reference numerals “21”, “22”, “23”, “24”, “25”, and “26”, which areprovided in conjunction with the respective package sites 11, 12, 13,14, 15, 16 on the substrate 10. It is to be noted that the number ofheat spreaders on the heat-spreader frame 20 is an arbitrary designchoice depending on the number of predefined package sites on thesubstrate 10.

[0027] The heat-spreader frame 20 can be a legged type or a non-leggedtype. In this first preferred embodiment, the heat-spreader frame 20 isa legged type having a plurality of legs 20 a arranged on the peripheraledges thereof and bent down in perpendicular to the heat spreaders 21,22, 23, 24, 25, 26 (the non-legged type is used in the second preferredembodiment, which will be described later in this specification).

[0028] Referring further to FIG. 1C, in the next step, a die-bondingprocess is performed to mount a batch of semiconductor chips (only threeare shown in the sectional view of FIG. 1C, which are designated by thereference numerals 31, 32, 33 respectively) respectively on the packagesites 11, 12, 13 on the front surface 10 a of the substrate 10 (notethat only three of the six package sites 11, 12, 13, 14, 15, 16 shown inFIG. 1A are seen in the sectional view of FIG. 1C). Subsequently, awire-bonding process is performed to electrically couple thesemiconductor chips 31, 32, 33 to the substrate 10 by means of bondingwires 40, such as gold wires.

[0029] After that, the next step is to perform an encapsulation processusing an encapsulation mold 50 having a downward-recessed cavity 50 a.First, the heat-spreader frame 20 is dropped in an upside-down mannerinto the cavity 50 a of the encapsulation mold 50, with its legs 20 apointing upwards; and next, the substrate 10, together with thesemiconductor chips 31, 32, 33 mounted thereon, is turned upside down(i.e., with the back surface 10 b of the substrate 10 facing upwards)and then placed on the heat-spreader frame 20, with the edge of itsfront surface 10 a being adhered to the tips of the upward-pointing legs20 a of the heat-spreader frame 20.

[0030] Referring further to FIG. 1D, when the heat-spreader frame 20 andthe substrate 10 are readily set in position in the cavity 50 a of theencapsulation mold 50, an encapsulating material, such as resin, isinjected into the cavity 50 a of the encapsulation mold 50 to form asingle continuous encapsulation body 60 which encapsulates all thesemiconductor chips 31, 32, 33 and the heat-spreader frame 20.

[0031] Referring further to FIG. 1E, as the encapsulation process iscompleted, the entire encapsulation body 60 is taken out of theencapsulation mold 50. Next, a ball-implantation process is performed toimplant a plurality of solder balls 70 on the back surface 10 b of thesubstrate 10.

[0032] Referring further to FIG. 1F, in the next step, a singulationprocess is performed to saw through the encapsulation body 60 (along thedashed lines shown in FIG. 1E that delimit the predefined package sites11, 12, 13 on the substrate 10), so as to cut apart the entire packagebody into individual package units as indicated by the referencenumerals “81”, “82”, and “83” in FIG. 1F. Each of the package units 81,82, 83 includes one of the package sites 11, 12, 13, one of the chips31, 32, 33, and one of the heat spreaders 21, 22, 23. This completes thefabrication of a batch of TFBGA packages.

[0033] In the foregoing method of the invention, since the entireheat-spreader frame 20 is relatively large in size as compared to thesize of an individual TFBGA package, it would be as a wholesignificantly easier to handle during the fabrication process than asingle piece of heat spreader, making embedding of a single piece ofheat spreader in each TFBGA package easy to implement.

[0034] Second Preferred Embodiment (FIGS. 2A-2E) The second preferredembodiment of the method of the invention is described in the followingwith reference to FIGS. 2A-2E. In FIGS. 2A-2E, the same parts as theprevious embodiment shown in FIGS. 1A-1F are labeled with the samereference numerals.

[0035] As shown in FIG. 2A, the second preferred embodiment differs fromthe previous one in that the heat-spreader frame 20 utilized here is anon-legged type (i.e., the legs 20 a shown in FIG. 1B of the previousembodiment are here not provided). Except this, the heat-spreader frame20 used here is substantially the same in shape as the previousembodiment, which also includes an integrally-formed matrix of heatspreaders 21, 22, 23, 24, 25, 26. Beside the heat-spreader frame 20, allthe other constituent parts of the second preferred embodiment areidentical in structure as the previous embodiment, so descriptionthereof will not be repeated here.

[0036] Referring next to FIG. 2B, during the encapsulation process, inorder to prevent resin flash on the bottom surface of the heat-spreaderframe 20, a flash-masking structure 20 b is formed over the bottomsurface of the heat-spreader frame 20. The flash-masking structure 20 bcan be, for example, a polyimide tape or an epoxy coating. Theheat-spreader frame 20 and the substrate 10 are then placed set in thecavity 50 a of the encapsulation mold 50 in the same manner as theprevious embodiment (except in this case, the heat-spreader frame 20 hasno legs to support the substrate 10).

[0037] Referring further to FIG. 2C, when the heat-spreader frame 20 andthe substrate 10 are readily set in position in the cavity 50 a of theencapsulation mold 50, an encapsulating material, such as resin, isinjected into the cavity 50 a of the encapsulation mold 50 to form asingle continuous encapsulation body 60 which encapsulates all thesemiconductor chips 31, 32, 33 and the heat-spreader frame 20. Duringthis process, however, part of the injected resin may be flashed ontothe bottom surface of the flash-masking structure 20 b that comes intouch with the bottom surface of the cavity 50 a.

[0038] Referring further to FIG. 2D, as the encapsulation process iscompleted, the entire encapsulation body 60 is taken out of theencapsulation mold 50. From the encapsulation process, however, a smallamount of flashed resin 20 c might be left over the exposed surface ofthe flash-masking structure 20 b over the heat-spreader frame 20.

[0039] Referring further to FIG. 2E, in the next step, the flash-maskingstructure 20 b, together with the flashed resin 20 c thereon, areremoved by using a special solvent or other suitable etching means. Thisallows no flashed resin to be left over the exposed surface of theheat-spreader frame 20. If the flash-masking structure 20 b were notprovided, the flashed resin 20 c would be left directly over the exposedsurface of the heat-spreader frame 20, which would then be verydifficult to remove.

[0040] The subsequent steps of ball implantation and singulation are allthe same as the previous embodiment, so description thereof will not berepeated.

[0041] The foregoing method of the invention allows the embedding of aflash-free heat spreader in each TFBGA package.

[0042] Third Preferred Embodiment (FIGS. 3A-3C)

[0043] The third preferred embodiment of the method of the invention isdisclosed in the following with reference to FIGS. 3A-3C. In FIGS.3A-3C, the same parts as the previous embodiments are labeled with thesame reference numerals.

[0044] This embodiment is largely the same as the first embodimentexcept that the substrate 10 needs not be turned upside down during theencapsulation process. Details are described below.

[0045] Referring first to FIG. 3A, as the substrate 10 is readilymounted with the semi15 conductor chips 31, 32, 33, the tips of the legs20 a of the heat-spreader frame 20 are adhered by means of an adhesiveagent (not shown) onto the front surface 10 a of the substrate 10.

[0046] Referring further to FIG. 3B, the next step is to perform anencapsulation process, in which the substrate 10 together with thesemiconductor chips 31, 32, 33 mounted thereon are placed in anencapsulation mold 51 having a bottom-side upward-recessed cavity 51 a,without being turned upside down as in the case of the first embodiment,for the purpose of forming an encapsulation body 60 which encapsulatesall the semiconductor chips 31, 32, 33 and the heat-spreader frame 20.

[0047] Referring further to FIG. 3C, as the encapsulation process iscompleted, the entire encapsulation body 60 is taken out of theencapsulation mold 51. Next, a ball-implantation process is performed toimplant a plurality of solder balls 70 on the back surface 10 b of thesubstrate 10. After this, a singulation process is performed to sawthrough the encapsulation body 60 along the dashed lines shown in FIG.3C that delimit the predefined package sites 11, 12, 13 on the substrate10. The subsequent steps are all the same as the first embodiment, sodescription thereof will not be repeated herein.

[0048] Fourth Preferred Embodiment (FIGS. 4A-4B)

[0049] The fourth preferred embodiment of the method of the invention isdisclosed in the following with reference to FIGS. 4A-4B. In FIGS.4A-4B, the same parts as the previous embodiments are labeled with thesame reference numerals.

[0050] Referring to FIG. 4A, this embodiment differs from the previousones only in that the semiconductor chips 31, 32, 33 are electricallycoupled to the substrate 10 through the flip-chip technology by means ofsolder bumps 41 instead of the wire-bonding technology utilized in theprevious embodiments. FIG. 4B shows a singulated TFBGA package unit.Beside the use of the flip-chip technology, all the other process stepsare the same as the previous embodiments, so description thereof willnot be repeated herein.

[0051] Various Other Modifications to the Legged Type of Heat-SpreaderFrame

[0052] Beside the design shown in FIG. 1B, the legged type ofheat-spreader frame can have various other modifications, asrespectively shown in FIG. 5, FIGS. 6A-6C, FIGS. 7A-7C, FIGS. 8A-8C,FIGS. 9A-9C, and FIGS. 10A-10C. In these figures, similar parts arelabeled with the same reference numerals.

[0053]FIG. 5 is a schematic perspective view of a variety to the leggedtype of heat-spreader frame 20 utilized by the invention. As shown, inthis embodiment, the heat spreaders 21, 22, 23, 24, 25, 26 areintegrally formed into a flat piece having a plurality of legs 20 aaround the edge thereof

[0054] FIGS. 6A-6C are schematic diagrams of another variety to thelegged type of heat-spreader frame 20 utilized by the invention; whereinFIG. 6A shows a top view of this heat-spreader frame 20; FIG. 6B shows aside view of the same; and FIG. 6C shows a sin-singulated TFBGA packageunit with an embedded heat spreader 21 cutting apart from theheat-spreader frame 20 shown in FIGS. 6A-6B. This heat-spreader frame 20is characterized in that the heat spreaders 21, 22, 23, 24, 25, 26 areflatly shaped both in front surface and in back surface.

[0055] FIGS. 7A-7C are schematic diagrams of still another variety tothe legged type of heat-spreader frame 20 utilized by the invention;wherein FIG. 7A shows a bottom view of this heat-spreader frame 20; FIG.7B shows a side view of the same; and FIG. 7C shows a singulated TFBGApackage unit with an embedded heat spreader 21 cutting apart from theheat-spreader frame 20 shown in FIGS. 7A-7B. This heat-spreader frame 20is characterized in that the heat spreaders 21, 22, 23, 24, 25, 26 areflatly shaped in front surface, and are each formed with a protrudedblock 20 d in the back surface. As shown in FIG. 7C, the provision ofthe protruded block 20 d can help reduce the heat path from thesemiconductor chip 31 to the heat spreader 21, so that theheat-dissipation efficiency can be increased.

[0056] FIGS. 8A-8C are schematic diagrams of still yet another varietyto the legged type of heat-spreader frame 20 utilized by the invention;wherein FIG. 8A shows a bottom view of this heat-spreader frame 20; FIG.8B shows a side view of the same; and FIG. 8C shows a singulated TFBGApackage unit with an embedded heat spreader 21 cutting apart from theheat-spreader frame 20 shown in FIGS. 8A-8B. This heat-spreader frame 20is characterized in that the heat spreaders 21, 22, 23, 24, 25, 26 areflatly shaped in front surface, and are each formed with a plurality ofdimples 20 e in back surface. As shown in FIG. 8C, the provision ofthese dimples 20 e can help increase the contact area between the heatspreader 21 and the encapsulation body 60, thus further strengtheningthe bonding between the heat spreader 21 and the encapsulation body 60.

[0057] FIGS. 9A-9C are schematic diagrams of yet another variety to thelegged type of heat-spreader frame 20 utilized by the invention; whereinFIG. 9A shows a bottom view of this heat-spreader frame 20; FIG. 9Bshows a side view of the same; and FIG. 9C shows a singulated TFBGApackage unit with an embedded heat spreader 21 cutting apart from theheat-spreader frame 20 shown in FIGS. 9A-9B. This heat-spreader frame 20is characterized in that the heat spreaders 21, 22, 23, 24, 25, 26 areflatly shaped in front surface, and are each formed with a plurality ofcrosswise and lengthwise interleaved grooves 20 f in back surface. Asshown in FIG. 9C, the provision of these grooves 20 f can help increasethe contact area between the heat spreader 21 and the encapsulation body60, thus further strengthening the bonding between the heat spreader 21and the encapsulation body 60.

[0058] FIGS. 10A-10C are schematic diagrams of another additionalvariety to the legged type of heat-spreader frame 20 utilized by theinvention; wherein FIG. 10A shows a top view of this heat-spreader frame20; FIG. 10B shows a side view of the same; and FIG. 10C shows asingulated TFBGA package unit with an embedded heat spreader 21 cuttingapart from the heat-spreader frame 20 shown in FIGS. 10A-10B. Thisheat-spreader frame 20 is characterized in that the heat spreaders 21,22, 23, 24, 25, 26 are each formed with a protruded block 20 g in frontsurface and a plurality of through holes 20 h around each protrudedblock 20 g. As shown in FIG. 10C, the provision of the protruded block20 g can help reduce the heat path from the semiconductor chip 31 to theheat spreader 21, while the through holes 20 h can act as bolting meansthat can help secure the heat spreader 21 firmly to the encapsulationbody 60, so that the heat spreader 21 would hardly break away from theencapsulation body 60.

[0059] The invention has been described using exemplary preferredembodiments. However, it is to be understood that the scope of theinvention is not limited to the disclosed embodiments. On the contrary,it is intended to cover various modifications and similar arrangements.The scope of the claims, therefore, should be accorded the broadestinterpretation so as to encompass all such modifications and similararrangements.

What is claimed is:
 1. A method for fabricating an integrated circuitpackage, comprising the steps of: (1) preparing a substrate having afront surface and a back surface, and which is predefined with aplurality of package sites; (2) preparing a heat-spreader frameincluding an integrally-formed matrix of heat spreaders having a frontsurface and a back surface, each heat spreader corresponding to one ofthe predefined package sites on the substrate; (3) bonding andelectrically-coupling a plurality of semiconductor chips to respectivepackage sites on the front surface of the substrate; (4) assembling theheat-spreader frame to the substrate in such a manner that each heatspreader is positioned proximate to one of the semiconductor chips onthe substrate; (5) performing an encapsulation process to form anencapsulation body which encapsulates the semiconductor chips and theheat-spreader frame; (6) performing a ball-implantation process toimplant a plurality of solder balls on the back surface of thesubstrate; and (7) singulating through the encapsulation body to cutapart the plurality of package sites on the substrate into individualpackage units, each serving as the intended integrated circuit package.2. The method of claim 1, wherein in said step (1), the substrate is aBT substrate.
 3. The method of claim 1, wherein in said step (1), thesubstrate is an FR4 substrate.
 4. The method of claim 1, wherein in saidstep (1), the substrate is a polyimide tape.
 5. The method of claim 1,wherein in said step (2), the heat-spreader frame is a legged typehaving a plurality of legs extending from the back surface thereof. 6.The method of claim 5, wherein the legged type of heat-spreader frame isflatly shaped both in the front surface and the back surface thereof. 7.The method of claim 5, wherein the legged type of heat-spreader frame isflatly shaped in the front surface thereof, and is formed with aplurality of protruded blocks in the back surface thereof.
 8. The methodof claim 5 wherein the legged type of heat-spreader frame is flatlyshaped in the front surface thereof, and is formed with a plurality ofcrosswise and lengthwise interleaved grooves in the back surfacethereof.
 9. The method of claim 5, wherein, the legged type ofheat-spreader frame is flatly shaped in the front surface thereof and isformed with a plurality of dimples in the back surface thereof.
 10. Themethod of claim 5, wherein, the legged type of heat-spreader frame isformed with a plurality of protruded blocks in the front surfacethereof, and is further formed with a plurality of through holes aroundeach protruded block.
 11. The method of claim 1, wherein in said step(2), the heat-spreader frame is a non-legged type.
 12. The method ofclaim 11, further comprising the step of: (2-1) forming a flash-maskingstructure over one surface of the non-legged type of heat-spreaderframe.
 13. The method of claim 12, wherein the flash-masking structureis a polyimide tape.
 14. The method of claim 12, wherein theflash-masking structure is an epoxy coating.
 15. The method of claim 1,wherein in said step (3), the bonding and electrically-coupling of thesemiconductor chips to the substrate is implemented through wire-bondingtechnology.
 16. The method of claim 1, wherein in said step (3), thebonding and electrically-coupling of the semiconductor chips to thesubstrate is implemented through flip-chip technology.
 17. The method ofclaim 5, wherein in said step (4), the assembling of the legged-type ofheat-spreader frame to the substrate includes the substeps of: (4-1a)preparing an encapsulation mold having a downward-recessed cavity;(4-2a) dropping the legged-type of heat-spreader frame in thedownward-recessed cavity of the encapsulation mold, with the legsthereof pointing upwards; and (4-3a) placing the substrate together withthe semiconductor chips in an upside-down manner on the drop-inheat-spreader frame in the downward-recessed cavity of the encapsulationmold.
 18. The method of claim 5, wherein in said step (4), theassembling of the heat-spreader frame to the substrate includes thesubsteps of: (4-1b) adhering the tips of the legs of the legged-type ofheat-spreader frame onto the front surface of the substrate.
 19. Themethod of claim 18, wherein in said step (5), the encapsulation processincludes the substeps of: preparing an encapsulation mold whose bottomside is formed with an upward-recessed cavity; and placing the substratetogether the heat-spreader frame in the upward-recessed cavity of theencapsulation mold.